题目：Hybrid and Composite Waveguide Integration Technologies for Millimeter-Wave/Terahertz Systems and Broadband/Ultrafast Electronics

时间：2024年8月5日星期一 9:00-12:00

地点：行政楼108/111

报告人：Prof. Ke Wu

专家介绍

Dr. Ke Wu is Industrial Research Chair in Future Wireless Technologies and Professor of Electrical Engineering with Polytechnique Montréal (University of Montreal), where he is also Director of Poly-Grames Research Center. He was the Canada Research Chair in RF and millimeter-wave engineering, NSERC-Huawei Endowed Chair, and the Founding Director of the Center for Radiofrequency Electronics Research of Quebec. He has authored/co-authored over 1500 referred technical papers, and many books/book chapters and filed more than 90 patents. Dr. Wu was the organizer of numerous conferences and events including the General Chair of the 2012 IEEE MTT-S International Microwave Symposium (IMS – the largest IEEE annual conference). He was the 2016 President of the IEEE Microwave Theory and Technology Society (MTT-S). He also served as the two-terms inaugural representative of North America in the General Assembly of the European Microwave Association (EuMA). He was the recipient of many awards and prizes including the 2019 IEEE MTT-S Microwave Prize, the 2021 EIC Julian C. Smith Medal, 2022 IEEE MTT-S Outstanding Educator Award, and 2022 IEEE AP-S John Kraus Antenna Award. He was an IEEE MTT-S Distinguished Microwave Lecturer. Dr. Ke Wu is a Fellow of the IEEE, the Canadian Academy of Engineering, and the Academy of Science of the Royal Society of Canada, and the German National Academy of Science and Engineering (acatech).

报告内容

Widespread applications and commercial success of millimeter-wave (mmW) and terahertz (THz) electronics and photonics depend on manufacturing cost, loss management, interference control. and integration density of their front-end modules and systems. On the other hand, the desire for prospective terabits and ultrafast electronics may eventually become the fundamental driving force for the development of next generation low-loss and low-dispersion guided-wave structures. This plenary talk will begin with the presentation of waveguide integration and transmission lines for the development of THz systems and applications. State-of-the-art substrate integration technologies including both metallic and dielectric topologies are reviewed for current mainstreaming THz ICs developments and applications. Fundamental issues judging from transmission loss and integration density are addressed. To overcome such technical hurdles for future THz circuits and systems, emerging composite waveguide architectures and hybrid planar integration strategies are demonstrated and discussed with theoretical and experimental results at THz frequencies. With the development of innovative fabrication processes and material synthesis techniques, unique high-density THz ICs and interconnects can be made of diversified metallic and dielectric integrated waveguides within the same design blocks in support of both TEM mode and non-TEM mode.

联系人：沙威